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2026 Council of Members Meeting

30 June 2026

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HFR-Free Leadership Program

Projects under this Program

HFR-Free Signal Integrity - Chair: Steve Hall (Intel), Co-chair: David Senk (Cisco)
HFR-Free PCB Material - Chair: John Davignon (Intel)

Background

Several major OEMs are evaluating a conversion to HFR (halogenated flame retardant)-free PCB materials.  While mobile phone manufacturers are well along in this effort, the next area of impact will likely be driven by high-volume consumer computer applications.

An industry-wide conversion to HFR-free materials faces numerous challenges:

  • Reliability of materials with alternative flame retardants has not been fully qualified.
  • Complete "technology envelopes" or technical specifications have not been established for various product applications.
  • Incomplete design knowledge in segments of the supply chain increases risk of conversion issues.
  • A rapid complete conversion of computer products will have a major impact on the supply chain and needs to be coordinated.

INEMI is working with several of our major OEM members to assess the feasibility of a broad conversion to HFR-Free PCB materials.  While IPC and JEDEC are developing halogen-free standard specifications and numerous companies have compliant materials, significant questions remain regarding overall readiness to make a transition to these materials.  For example:

  • What electrical properties are needed to meet high-speed signaling requirements?
  • With many HFR-free materials showing higher stiffness, what mechanical properties are needed to ensure system reliability isn't degraded?
  • Can design modifications reduce sensitivity to electrical and material properties?

 

Statement of Work

Statement of Work:  INEMI HFR-Free Technology Leadership Program (Version 5.0; May 15, 2009)

 

Presentations Papers

White Paper:  INEMI Timeline for HFR-Free Electronics & PVC-Free Cabling (October 2010)
Symposium on Global ICT Environmental Initiatives (October 27-28, 2009, Brussels)
INEMI paper on HFR-free receives a best paper award from SMTA China (August 2009)

 

Position Statement

INEMI Position Statement on the Definition of "Low-Halogen" Electronics (BFR/CFR/PVC-Free) (07/01/09)

 

Press Releases

INEMI HFR-Free Leadership Program Launches with 22 Companies Participating (08/03/09)
INEMI Members Release Position Statement on the Definition of “Low Halogen” for Electronic Products (07/01/09)
INEMI Organizes New Program to Support Supply Chain Conversion to HFR-Free PCBs (03/31/09)

 

For Additional Information

[email protected]

Project Leader


Chair: Stephen Tisdale, Intel

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